Key Applications
- Hyperscale and Hyperconverged Solutions
- Cloud Computing
- Cluster Node
- Data Center
- HPC cluster computer nodes
Key Features 8 Hot-pluggable System Nodes in a 4U form factor. Each node supports:1. Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)2. Up to 4TB ECC 3DS LRDIMM,
up to DDR4-3200MHz; 16 DIMM slots3. Expansion slots: 2 PCI-E 4.0 x16 (LP Riser),
1 PCI-E 4.0 x16 AIOM slot4. AIOM Network card,
1 dedicated IPMI LAN port5. 1 VGA, 2 USB 3.0 ports6. Up to 4 fixed internal 2.5" drive bays:
4 SATA3 by default,
or optional 2 NVMe via additional cable M.2 Interface: 2 SATA/NVMe, PCI-E 4.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key7. 8 heavy-duty 8cm 13.5k RPM rear fans per enclosure8. 2000W or above Redundant Power Supplies (Full redundancy based on
configuration and application load)
Complete System Only: To maintain quality and integrity, this product is sold only as a completely assembled system (for optimal performance 8 DIMMs is recommended). Minimum requirement is 1 CPU, 4 DIMMs, 1 HDD/NVMe and 1 AIOM/AOC NIC card per node.
Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
Socket SP3
Supports CPU TDP / cTDP up to 280W*
Cores
Up to 64 Cores
Note
* Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization
System Memory
(per Node)
Memory Capacity
16 DIMM slots
Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs
Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.