Supermicro's Advanced GPU Systems for Generative AI Applications with Dual 5th Gen Intel Xeon Processors Will Take Advantage of the Increased Number of Cores, Performance, and Performance Per Watt in The Same Power Envelope

全新 Supermicro H13 WIO 系列包括符合NEBS标准的系统，提供交流或直流电源选项，起始TDP功耗仅为80W并可扩展至 64 核，为智能边缘和电信应用提供能源效率、灵活配置和平台密度

The Supermicro Multi-Node BigTwin® HCI System with 4th Gen Intel® Xeon® Scalable Processors Provides 2X the I/O Bandwidth with PCIe 5.0 and up to 1.5X the memory bandwidth with DDR5 and Supports Built-in CPU Accelerators for Workload Specific Performance Gains

Rich Set of New Systems to Support E3.S All-Flash Solutions and E3.S CXL Memory Module (CMM) Expansion Solutions with E3.S Drives Available from Every Flash Vendor, Increasing Customer Flexibility and Choice

Presenting an Open Forum of Industry Leaders on the Future of High-Performance Software Defined Storage for AI, HPC, and Data-Intensive Workloads

New MegaDC Servers Incorporate the New AmpereOne™ CPU for Microservices, Telco Edge, Web Servers, Caching Services, Media Encoding, and Video Game Streaming

Unique New Multi-Node System Provides Cost Optimized Performance at Scale for eCommerce, Software Development, Cloud Gaming, Content Creation, and Private Server Instances

AMD EPYC 9004 系列处理器系统产品组合持续演进，全新优化阵容拥有多达 128 个全新“Zen 4c”内核，同时搭载 AMD 3D V-Cache 技术，再创密度和能效巅峰境界

针对数据中心到边缘应用，Supermicro从设计到制造提供全方位机架级解决方案，提供卓越性能、灵活性和能源效率，并实现快速部署

Supermicro 创始人兼首席执行官梁见后与NVIDIA首席执行官黄仁勋，及其他业内领导人将共同探讨加速云、人工智能、边缘和存储工作负载的发展，推动机架级制造投资，以及降低当前数据中心环境影响的绿色计算技术创新